×
(877) 992-1930
Login
Register
Why Sensible
What We Do
Resources
Blog
Customer Portal
Line Card
Request a Quote
Menu
×
XC9572XL-5VQ64C
XC9572XL-5VQ64C
SOURCING AVAILABLE
Overview
Manufacturer
:
ADVANCED MICRO DEVICES, INC.
Part Number
:
XC9572XL-5VQ64C
Description
:
CPLD XC9500 Family 1.6K Gates 72 Macro Cells 178.6MHz 0.35um, CMOS Technology 3.3V 64-Pin VTQFP
Datasheet
:
View / Download
Get Quote
Specifications
PCN
Lifecycle
Environment
SPECIFICATIONS:
Part Number:
XC9572XL-5VQ64C
Manufacturer:
ADVANCED MICRO DEVICES, INC.
Type:
Complex Programmable Logic Devices - CPLDs
Description:
CPLD XC9500 Family 1.6K Gates 72 Macro Cells 178.6MHz 0.35um, CMOS Technology 3.3V 64-Pin VTQFP
Datasheet:
View / Download
Lifecycle:
Obsolete
RoHS:
No
RoHS Version:
2011/65/EU, 2015/863
PCN ALERT(S):
PCN#
Type
Description
Source
Date
XCN23009 (v1.1)
Obsolescence Notices,Removed from Cost Book-NC/NR
Additional context added to description section.AMD will be discontinuing XC9500XL, CoolRunner XPLA 3, CoolRunner II, Spartan II, and Spartan 3, 3A, 3AN,3E, 3ADSP Commercial/ Industrial "XC" and Automotive "XA" Product Families due to declining run-rates and challenges maintaining legacy test infrastructure.No Replacements provided.
View / Download
1/29/2024
XCN23009 (v1.0)
Obsolescence Notices,Removed from Cost Book-NC/NR
AMD will be discontinuing XC9500XL, CoolRunner XPLA 3, CoolRunner II, Spartan II, and Spartan 3, 3A, 3AN, 3E, 3ADSP Commercial/ Industrial XC and Automotive XA Product Families.No Replacements provided.
View / Download
1/1/2024
XTP526 (v1.2)
Materials
Xilinx assembly supplier will stop Sn/Pb solder planting process in devices from date code DC2001. Therefore, Xilinx has changed the lead-frame from Ag L/F plating to PPF
View / Download
11/23/2020
XTP526 (v1.1)
Materials
To ensure business continuity and enable high-volume supply-chain capability for all tin-lead (Sn/Pb) plating type products, Xilinx is qualifying Pre-Plated Lead-Frame (PPF) without solder plating process for QFP packages.
View / Download
3/30/2020
XCN19020 (v1.3)
Labeling
Xilinx will be changing the format of the label on moisture barrier bag (MBB), inner box and outer carton for all 2D products (7 Series, UltraScale, UltraScale+ and new products).
View / Download
12/16/2019
XCN19020 (v1.2)
Labeling
Xilinx will be changing the format of the label on moisture barrier bag (MBB), inner box and outer carton for all 2D products (7 Series, UltraScale, UltraScale+ and new products).
View / Download
10/14/2019
XCN18024 (v1.0)
Materials
Xilinx will be changing lead-frame plating composition from the current tin-lead (Sn/Pb) to palladium-nickel-gold (Pd/Ni/Au) using a pre-plated lead-frame
View / Download
10/29/2018
XTP526 (v1.0)
Assembly Process
Xilinx is qualifying Pre-Plated Lead-Frame (PPF) without solder plating process for QFP packages
View / Download
10/29/2018
XCN18015 (v1.0)
Labeling
The purpose of this notification is to communicate that Xilinx has changed the format of the label on moisture barrier bag (MBB), inner box and outer carton for all products
View / Download
5/28/2018
XCN13033 (v1.1)
Assembly Site
As part of Xilinx global supply chain continuity and efficiency, Xilinx is adding a new approved logistics service provider. This additional logistics service provider will be qualified to provide these services for all Xilinx products.At the end of this change, Xilinx will be shipping products from Xilinx USA, Xilinx Singapore, and the warehouses in Taiwan and Singapore.
View / Download
2/17/2014
XCN13031 (v1.1)
Test Site
Xilinx is adding final test capability with our current certified wafer sort test facility in Taiwan for product continuity. All Xilinx test programs will be transferred to this facility. There is no change to form, fit, function or reliability.refer to XCN14009
View / Download
2/10/2014
XCN13033 (v1.0)
Assembly Site
As part of Xilinx global supply chain continuity and efficiency, Xilinx is adding a new approved logistics service provider. This additional logistics service provider will be qualified to provide these services for all Xilinx products and At the end of this change, Xilinx will be shipping products from Xilinx USA, Xilinx Singapore, and the warehouses in Taiwan and Singapore.
View / Download
11/11/2013
XCN13031 (v1.0)
Test Site
Xilinx is adding final test capability with our current certified wafer sort test facility in Taiwan for product continuity. All Xilinx test programs will be transferred to this facility. There is no change to form, fit, function or reliability.
View / Download
11/4/2013
XCN12022 (v1.0)
Assembly Process,Marking Molding
Xilinx's Assembly Suppliers are converting from corner gate mold to pin gate mold for TQ G 100, TQ G 144 and VQ G 100 packages,Suppliers are transitioning mature TQ G and VQ G devices to PGM for improved productivity,The PGM process is designed with JEDEC compliant package drawing and there is no change to Xilinx package dimensions,refer to XCN12026
View / Download
12/17/2012
N/A
Vendor Acquisition
Modesat Communications has been acquired by Xilinx.
View / Download
9/17/2012
N/A
Vendor Acquisition
PetaLogix Corporation has been acquired by Xilinx.
View / Download
8/28/2012
N/A
Vendor Acquisition
SeaMicro, Inc has been acquired by AMD.
View / Download
2/29/2012
XCN11018 (v2.0)
Assembly Site
Due to the recent earthquake in Japan, there is a worldwide shortage of Bismaleimide-Triazine (BT) resin material used in the package core and prepreg layers of wirebond packages. To enable supply continuity, additional sources of package core and prepreg are being qualified. The additional package core and prepreg sources are from Nanya, Hitachi and Doosan suppliers.
View / Download
7/25/2011
XCN11018 (v1.0.1)
Assembly Process
Due to the recent earthquake in Japan, there is a worldwide shortage of Bismaleimide-Triazine (BT) resin material used in the package core and prepreg layers of wirebond packages. To enable supply continuity, additional sources of package core and prepreg are being qualified. The additional package core and prepreg sources are from Nanya, Hitachi and Doosan suppliers.
View / Download
6/15/2011
XCN11018 (v1.0)
Assembly Site
Due to the recent earthquake in Japan, there is a worldwide shortage of Bismaleimide-Triazine (BT) resin material used in the package core and prepreg layers of wirebond packages. To enable supply continuity, additional sources of package core and prepreg are being qualified
View / Download
6/13/2011
N/A
Vendor Acquisition
Sarance Technologies Inc has been acquired by Xilinx.
View / Download
5/17/2011
N/A
Vendor Acquisition
Modelware has been acquired by Xilinx.
View / Download
5/9/2011
N/A
Vendor Acquisition
AutoESL Design Technologies, Inc has been acquired by Xilinx.
View / Download
1/31/2011
N/A
Vendor Acquisition
AMD acquires Alchemy Semiconductor
View / Download
11/6/2007
N/A
Vendor Acquisition
AMD acquires ATI Technologies
View / Download
10/25/2006
N/A
Vendor Acquisition
AccelChip, Inc has been Acquired by Xilinx.
View / Download
1/13/2006
XCN05003 (v1.0)
Marking Molding,Product Code,Wafer Site
The XC95144XL and XC9572XL CPLD devices will transition from a 0.35µm four-layer metal Flash CMOS process at UMC, Taiwan to a 0.35µm four-layer metal Flash CMOS process at He Jian Technology Company, China. This change improves the ability of Xilinx to support this product effectively
View / Download
1/31/2005
XCN05003
Wafer Process
Change in Wafer Fabrication Facility for XC95144XL and XC9572XL CPLDs.
View / Download
1/31/2005
N/A
Vendor Acquisition
Xilinx acquires Triscend
View / Download
3/8/2004
N/A
Vendor Acquisition
Monolithic Memories, Inc has been acquired by AMD.
View / Download
1/1/1987
LIFECYCLE:
Status
Obsolete
LTB Date
Jun 29, 2024
Source
Not Available
Est. EOL
Not Available
Lifecycle
Obsolete
Risk Grade
High
Overall Risk
89.7%
ENVIRONMENT:
RoHS Status
Not Compliant
Details
Not Available
Source Type
Material Declaration
Exemption
Not Available
Exemption Type
Not Available
Exemption Codes
Not Available
Rohs Identifier
NO
Lead Free
Not Compliant
Rare Earth Element Information
Rare Earth Free
Conflict Mineral Status
DRC Conflict Free
Conflict Mineral Statement
Not Available
EICC Membership
No
×
Quote Request In Process.
Thank you, we will be in touch with you shortly.
Details: