×
(877) 992-1930
Login
Register
Why Sensible
What We Do
Resources
Blog
Customer Portal
Line Card
Request a Quote
Menu
×
XC3S1200E-4FGG320C
XC3S1200E-4FGG320C
SOURCING AVAILABLE
Overview
Manufacturer
:
ADVANCED MICRO DEVICES, INC.
Part Number
:
XC3S1200E-4FGG320C
Description
:
FPGA Spartan®-3E Family 1.2M Gates 19512 Cells 572MHz 90nm Technology 1.2V 320-Pin FBGA Tray
Datasheet
:
View / Download
Get Quote
Specifications
PCN
Lifecycle
Environment
SPECIFICATIONS:
Part Number:
XC3S1200E-4FGG320C
Manufacturer:
ADVANCED MICRO DEVICES, INC.
Type:
Field Programmable Gate Arrays - FPGAs
Description:
FPGA Spartan®-3E Family 1.2M Gates 19512 Cells 572MHz 90nm Technology 1.2V 320-Pin FBGA Tray
Datasheet:
View / Download
Lifecycle:
Obsolete
RoHS:
Yes
RoHS Version:
2011/65/EU, 2015/863
PCN ALERT(S):
PCN#
Type
Description
Source
Date
XCN23009 (v1.1)
Obsolescence Notices,Removed from Cost Book-NC/NR
Additional context added to description section.AMD will be discontinuing XC9500XL, CoolRunner XPLA 3, CoolRunner II, Spartan II, and Spartan 3, 3A, 3AN,3E, 3ADSP Commercial/ Industrial "XC" and Automotive "XA" Product Families due to declining run-rates and challenges maintaining legacy test infrastructure.No Replacements provided.
View / Download
1/29/2024
XCN23009 (v1.0)
Obsolescence Notices,Removed from Cost Book-NC/NR
AMD will be discontinuing XC9500XL, CoolRunner XPLA 3, CoolRunner II, Spartan II, and Spartan 3, 3A, 3AN, 3E, 3ADSP Commercial/ Industrial XC and Automotive XA Product Families.No Replacements provided.
View / Download
1/1/2024
XCN20004 (v1.0)
Packing
Xilinx is adding additional trays produced by Daewon for some products.The Daewon tray matrices are designed to be compatible with the current Kostat shipping tray. However,it is non-stackable with the Kostat tray due to a slip lock feature. Customers are recommended not to stack the Daewon trays with Kostat trays.
View / Download
5/18/2020
XCN19020 (v1.3)
Labeling
Xilinx will be changing the format of the label on moisture barrier bag (MBB), inner box and outer carton for all 2D products (7 Series, UltraScale, UltraScale+ and new products).
View / Download
12/16/2019
XCN19020 (v1.2)
Labeling
Xilinx will be changing the format of the label on moisture barrier bag (MBB), inner box and outer carton for all 2D products (7 Series, UltraScale, UltraScale+ and new products).
View / Download
10/14/2019
XCN18015 (v1.0)
Labeling
The purpose of this notification is to communicate that Xilinx has changed the format of the label on moisture barrier bag (MBB), inner box and outer carton for all products
View / Download
5/28/2018
XCN13033 (v1.1)
Assembly Site
As part of Xilinx global supply chain continuity and efficiency, Xilinx is adding a new approved logistics service provider. This additional logistics service provider will be qualified to provide these services for all Xilinx products.At the end of this change, Xilinx will be shipping products from Xilinx USA, Xilinx Singapore, and the warehouses in Taiwan and Singapore.
View / Download
2/17/2014
XCN13031 (v1.1)
Test Site
Xilinx is adding final test capability with our current certified wafer sort test facility in Taiwan for product continuity. All Xilinx test programs will be transferred to this facility. There is no change to form, fit, function or reliability.refer to XCN14009
View / Download
2/10/2014
XCN13033 (v1.0)
Assembly Site
As part of Xilinx global supply chain continuity and efficiency, Xilinx is adding a new approved logistics service provider. This additional logistics service provider will be qualified to provide these services for all Xilinx products and At the end of this change, Xilinx will be shipping products from Xilinx USA, Xilinx Singapore, and the warehouses in Taiwan and Singapore.
View / Download
11/11/2013
XCN13031 (v1.0)
Test Site
Xilinx is adding final test capability with our current certified wafer sort test facility in Taiwan for product continuity. All Xilinx test programs will be transferred to this facility. There is no change to form, fit, function or reliability.
View / Download
11/4/2013
XCN12023 (v1.0.1)
Assembly Process,Marking Molding,Packing
Xilinx's Assembly Suppliers are transitioning from corner gate mold to pin gate mold for FG(G) and BG(G) packages. Suppliers are converting mature PBGA devices to PGM for improved productivity. PGM process is designed with the JEDEC compliant larger mold cap still meeting Xilinx’s outer package dimensions,refer to XCN12026.
View / Download
1/25/2013
XCN12023 (v1.0)
Assembly Process,Marking Molding,Packing
Xilinx's Assembly Suppliers are transitioning from corner gate mold to pin gate mold for FG G and BG G packages. Suppliers are converting mature PBGA devices to PGM for improved productivity,PGM process is designed with the JEDEC compliant larger mold cap still meeting Xilinx's outer package dimensions.
View / Download
12/17/2012
N/A
Vendor Acquisition
Modesat Communications has been acquired by Xilinx.
View / Download
9/17/2012
N/A
Vendor Acquisition
PetaLogix Corporation has been acquired by Xilinx.
View / Download
8/28/2012
N/A
Vendor Acquisition
SeaMicro, Inc has been acquired by AMD.
View / Download
2/29/2012
XCN11002 (v1.0)
Materials
Xilinx's conversion to copper wire is to align with the current industry trend to better support long-term demand for the affected products. Copper wire has demonstrated better electrical and mechanical performance than gold wire.
View / Download
8/15/2011
XCN11018 (v2.0)
Assembly Site
Due to the recent earthquake in Japan, there is a worldwide shortage of Bismaleimide-Triazine (BT) resin material used in the package core and prepreg layers of wirebond packages. To enable supply continuity, additional sources of package core and prepreg are being qualified. The additional package core and prepreg sources are from Nanya, Hitachi and Doosan suppliers.
View / Download
7/25/2011
XCN11018 (v1.0.1)
Assembly Process
Due to the recent earthquake in Japan, there is a worldwide shortage of Bismaleimide-Triazine (BT) resin material used in the package core and prepreg layers of wirebond packages. To enable supply continuity, additional sources of package core and prepreg are being qualified. The additional package core and prepreg sources are from Nanya, Hitachi and Doosan suppliers.
View / Download
6/15/2011
XCN11018 (v1.0)
Assembly Site
Due to the recent earthquake in Japan, there is a worldwide shortage of Bismaleimide-Triazine (BT) resin material used in the package core and prepreg layers of wirebond packages. To enable supply continuity, additional sources of package core and prepreg are being qualified
View / Download
6/13/2011
N/A
Vendor Acquisition
Sarance Technologies Inc has been acquired by Xilinx.
View / Download
5/17/2011
N/A
Vendor Acquisition
Modelware has been acquired by Xilinx.
View / Download
5/9/2011
N/A
Vendor Acquisition
AutoESL Design Technologies, Inc has been acquired by Xilinx.
View / Download
1/31/2011
XCN08006 (v1.0.1)
Assembly Process
The purpose of this notification is to announce the addition of a new second source molding compound for selected wirebond BGA packages.
View / Download
4/17/2008
N/A
Vendor Acquisition
AMD acquires Alchemy Semiconductor
View / Download
11/6/2007
N/A
Vendor Acquisition
AMD acquires ATI Technologies
View / Download
10/25/2006
N/A
Vendor Acquisition
AccelChip, Inc has been Acquired by Xilinx.
View / Download
1/13/2006
N/A
Vendor Acquisition
Xilinx acquires Triscend
View / Download
3/8/2004
N/A
Vendor Acquisition
Monolithic Memories, Inc has been acquired by AMD.
View / Download
1/1/1987
LIFECYCLE:
Status
Obsolete
LTB Date
Jun 29, 2024
Source
Not Available
Est. EOL
Not Available
Lifecycle
Obsolete
Risk Grade
High
Overall Risk
76.5%
ENVIRONMENT:
RoHS Status
Compliant
Details
Not Available
Source Type
Material Declaration
Exemption
No
Exemption Type
Not Available
Exemption Codes
Not Available
Rohs Identifier
YES
Lead Free
Compliant
Rare Earth Element Information
Not Available
Conflict Mineral Status
DRC Conflict Free
Conflict Mineral Statement
Not Available
EICC Membership
No
×
Quote Request In Process.
Thank you, we will be in touch with you shortly.
Details: