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XC3S250E-4VQ100C
XC3S250E-4VQ100C
SOURCING AVAILABLE
Overview
Manufacturer
:
ADVANCED MICRO DEVICES, INC.
Part Number
:
XC3S250E-4VQ100C
Description
:
FPGA Spartan®-3E Family 250K Gates 5508 Cells 572MHz 90nm Technology 1.2V 100-Pin VTQFP
Datasheet
:
View / Download
Get Quote
Specifications
PCN
Lifecycle
Environment
SPECIFICATIONS:
Part Number:
XC3S250E-4VQ100C
Manufacturer:
ADVANCED MICRO DEVICES, INC.
Type:
Field Programmable Gate Arrays - FPGAs
Description:
FPGA Spartan®-3E Family 250K Gates 5508 Cells 572MHz 90nm Technology 1.2V 100-Pin VTQFP
Datasheet:
View / Download
Lifecycle:
Obsolete
RoHS:
No
RoHS Version:
2011/65/EU, 2015/863
PCN ALERT(S):
PCN#
Type
Description
Source
Date
XCN23009 (v1.1)
Obsolescence Notices,Removed from Cost Book-NC/NR
Additional context added to description section.AMD will be discontinuing XC9500XL, CoolRunner XPLA 3, CoolRunner II, Spartan II, and Spartan 3, 3A, 3AN,3E, 3ADSP Commercial/ Industrial "XC" and Automotive "XA" Product Families due to declining run-rates and challenges maintaining legacy test infrastructure.No Replacements provided.
View / Download
1/29/2024
XCN23009 (v1.0)
Obsolescence Notices,Removed from Cost Book-NC/NR
AMD will be discontinuing XC9500XL, CoolRunner XPLA 3, CoolRunner II, Spartan II, and Spartan 3, 3A, 3AN, 3E, 3ADSP Commercial/ Industrial XC and Automotive XA Product Families.No Replacements provided.
View / Download
1/1/2024
XTP526 (v1.2)
Materials
Xilinx assembly supplier will stop Sn/Pb solder planting process in devices from date code DC2001. Therefore, Xilinx has changed the lead-frame from Ag L/F plating to PPF
View / Download
11/23/2020
XTP526 (v1.1)
Materials
To ensure business continuity and enable high-volume supply-chain capability for all tin-lead (Sn/Pb) plating type products, Xilinx is qualifying Pre-Plated Lead-Frame (PPF) without solder plating process for QFP packages.
View / Download
3/30/2020
XCN19020 (v1.3)
Labeling
Xilinx will be changing the format of the label on moisture barrier bag (MBB), inner box and outer carton for all 2D products (7 Series, UltraScale, UltraScale+ and new products).
View / Download
12/16/2019
XCN19020 (v1.2)
Labeling
Xilinx will be changing the format of the label on moisture barrier bag (MBB), inner box and outer carton for all 2D products (7 Series, UltraScale, UltraScale+ and new products).
View / Download
10/14/2019
XTP526 (v1.0)
Assembly Process
Xilinx is qualifying Pre-Plated Lead-Frame (PPF) without solder plating process for QFP packages
View / Download
10/29/2018
XCN18024 (v1.0)
Materials
Xilinx will be changing lead-frame plating composition from the current tin-lead (Sn/Pb) to palladium-nickel-gold (Pd/Ni/Au) using a pre-plated lead-frame
View / Download
10/29/2018
XCN18015 (v1.0)
Labeling
The purpose of this notification is to communicate that Xilinx has changed the format of the label on moisture barrier bag (MBB), inner box and outer carton for all products
View / Download
5/28/2018
XCN13033 (v1.1)
Assembly Site
As part of Xilinx global supply chain continuity and efficiency, Xilinx is adding a new approved logistics service provider. This additional logistics service provider will be qualified to provide these services for all Xilinx products.At the end of this change, Xilinx will be shipping products from Xilinx USA, Xilinx Singapore, and the warehouses in Taiwan and Singapore.
View / Download
2/17/2014
XCN13031 (v1.1)
Test Site
Xilinx is adding final test capability with our current certified wafer sort test facility in Taiwan for product continuity. All Xilinx test programs will be transferred to this facility. There is no change to form, fit, function or reliability.refer to XCN14009
View / Download
2/10/2014
XCN13033 (v1.0)
Assembly Site
As part of Xilinx global supply chain continuity and efficiency, Xilinx is adding a new approved logistics service provider. This additional logistics service provider will be qualified to provide these services for all Xilinx products and At the end of this change, Xilinx will be shipping products from Xilinx USA, Xilinx Singapore, and the warehouses in Taiwan and Singapore.
View / Download
11/11/2013
XCN13031 (v1.0)
Test Site
Xilinx is adding final test capability with our current certified wafer sort test facility in Taiwan for product continuity. All Xilinx test programs will be transferred to this facility. There is no change to form, fit, function or reliability.
View / Download
11/4/2013
N/A
Vendor Acquisition
Modesat Communications has been acquired by Xilinx.
View / Download
9/17/2012
N/A
Vendor Acquisition
PetaLogix Corporation has been acquired by Xilinx.
View / Download
8/28/2012
N/A
Vendor Acquisition
SeaMicro, Inc has been acquired by AMD.
View / Download
2/29/2012
XCN11002 (v1.0)
Materials
Xilinx's conversion to copper wire is to align with the current industry trend to better support long-term demand for the affected products. Copper wire has demonstrated better electrical and mechanical performance than gold wire.
View / Download
8/15/2011
XCN11018 (v2.0)
Assembly Site
Due to the recent earthquake in Japan, there is a worldwide shortage of Bismaleimide-Triazine (BT) resin material used in the package core and prepreg layers of wirebond packages. To enable supply continuity, additional sources of package core and prepreg are being qualified. The additional package core and prepreg sources are from Nanya, Hitachi and Doosan suppliers.
View / Download
7/25/2011
XCN11018 (v1.0.1)
Assembly Process
Due to the recent earthquake in Japan, there is a worldwide shortage of Bismaleimide-Triazine (BT) resin material used in the package core and prepreg layers of wirebond packages. To enable supply continuity, additional sources of package core and prepreg are being qualified. The additional package core and prepreg sources are from Nanya, Hitachi and Doosan suppliers.
View / Download
6/15/2011
XCN11018 (v1.0)
Assembly Site
Due to the recent earthquake in Japan, there is a worldwide shortage of Bismaleimide-Triazine (BT) resin material used in the package core and prepreg layers of wirebond packages. To enable supply continuity, additional sources of package core and prepreg are being qualified
View / Download
6/13/2011
N/A
Vendor Acquisition
Sarance Technologies Inc has been acquired by Xilinx.
View / Download
5/17/2011
N/A
Vendor Acquisition
Modelware has been acquired by Xilinx.
View / Download
5/9/2011
N/A
Vendor Acquisition
AutoESL Design Technologies, Inc has been acquired by Xilinx.
View / Download
1/31/2011
XCN10017 (v1.1)
Packing,Shipping
Xilinx is adding a new shipping tray produced by SUNRISE Plastics Industry for the 28mm x 28mm QFP packages and 31mm x 31mm BGA packages
View / Download
4/26/2010
N/A
Vendor Acquisition
AMD acquires Alchemy Semiconductor
View / Download
11/6/2007
N/A
Vendor Acquisition
AMD acquires ATI Technologies
View / Download
10/25/2006
N/A
Vendor Acquisition
AccelChip, Inc has been Acquired by Xilinx.
View / Download
1/13/2006
N/A
Vendor Acquisition
Xilinx acquires Triscend
View / Download
3/8/2004
PCN95013
Marking Molding
A minor change in the part marking methodology utilized for Xilinx Products.
View / Download
12/26/1995
N/A
Vendor Acquisition
Monolithic Memories, Inc has been acquired by AMD.
View / Download
1/1/1987
LIFECYCLE:
Status
Obsolete
LTB Date
Jun 29, 2024
Source
Not Available
Est. EOL
Not Available
Lifecycle
Obsolete
Risk Grade
High
Overall Risk
97%
ENVIRONMENT:
RoHS Status
Not Compliant
Details
Not Available
Source Type
Material Declaration
Exemption
Not Available
Exemption Type
Not Available
Exemption Codes
Not Available
Rohs Identifier
NO
Lead Free
Not Compliant
Rare Earth Element Information
Rare Earth Free
Conflict Mineral Status
DRC Conflict Free
Conflict Mineral Statement
Not Available
EICC Membership
No
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