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XC3S1600E-4FG484C

SOURCING AVAILABLE

Overview

Manufacturer:   ADVANCED MICRO DEVICES, INC.
Part Number:   XC3S1600E-4FG484C
Description:   FPGA Spartan®-3E Family 1.6M Gates 33192 Cells 572MHz 90nm Technology 1.2V 484-Pin FBGA
Datasheet:   View / Download
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SPECIFICATIONS:

Part Number: XC3S1600E-4FG484C
Manufacturer: ADVANCED MICRO DEVICES, INC.
Type: Field Programmable Gate Arrays - FPGAs
Description: FPGA Spartan®-3E Family 1.6M Gates 33192 Cells 572MHz 90nm Technology 1.2V 484-Pin FBGA
Datasheet: View / Download
Lifecycle: Obsolete
RoHS: No
RoHS Version: 2011/65/EU, 2015/863

PCN ALERT(S):

PCN#TypeDescriptionSourceDate
XCN23009 (v1.1)Obsolescence Notices,Removed from Cost Book-NC/NRAdditional context added to description section.AMD will be discontinuing XC9500XL, CoolRunner XPLA 3, CoolRunner II, Spartan II, and Spartan 3, 3A, 3AN,3E, 3ADSP Commercial/ Industrial "XC" and Automotive "XA" Product Families due to declining run-rates and challenges maintaining legacy test infrastructure.No Replacements provided.View / Download1/29/2024
XCN23009 (v1.0)Obsolescence Notices,Removed from Cost Book-NC/NRAMD will be discontinuing XC9500XL, CoolRunner XPLA 3, CoolRunner II, Spartan II, and Spartan 3, 3A, 3AN, 3E, 3ADSP Commercial/ Industrial XC and Automotive XA Product Families.No Replacements provided.View / Download1/1/2024
XCN19020 (v1.3)LabelingXilinx will be changing the format of the label on moisture barrier bag (MBB), inner box and outer carton for all 2D products (7 Series, UltraScale, UltraScale+ and new products).View / Download12/16/2019
XCN19020 (v1.2)LabelingXilinx will be changing the format of the label on moisture barrier bag (MBB), inner box and outer carton for all 2D products (7 Series, UltraScale, UltraScale+ and new products).View / Download10/14/2019
XCN18015 (v1.0)LabelingThe purpose of this notification is to communicate that Xilinx has changed the format of the label on moisture barrier bag (MBB), inner box and outer carton for all productsView / Download5/28/2018
XCN13033 (v1.1)Assembly SiteAs part of Xilinx global supply chain continuity and efficiency, Xilinx is adding a new approved logistics service provider. This additional logistics service provider will be qualified to provide these services for all Xilinx products.At the end of this change, Xilinx will be shipping products from Xilinx USA, Xilinx Singapore, and the warehouses in Taiwan and Singapore.View / Download2/17/2014
XCN13031 (v1.1)Test SiteXilinx is adding final test capability with our current certified wafer sort test facility in Taiwan for product continuity. All Xilinx test programs will be transferred to this facility. There is no change to form, fit, function or reliability.refer to XCN14009View / Download2/10/2014
XCN13033 (v1.0)Assembly SiteAs part of Xilinx global supply chain continuity and efficiency, Xilinx is adding a new approved logistics service provider. This additional logistics service provider will be qualified to provide these services for all Xilinx products and At the end of this change, Xilinx will be shipping products from Xilinx USA, Xilinx Singapore, and the warehouses in Taiwan and Singapore.View / Download11/11/2013
XCN13031 (v1.0)Test SiteXilinx is adding final test capability with our current certified wafer sort test facility in Taiwan for product continuity. All Xilinx test programs will be transferred to this facility. There is no change to form, fit, function or reliability.View / Download11/4/2013
XCN12023 (v1.0.1)Assembly Process,Marking Molding,PackingXilinx's Assembly Suppliers are transitioning from corner gate mold to pin gate mold for FG(G) and BG(G) packages. Suppliers are converting mature PBGA devices to PGM for improved productivity. PGM process is designed with the JEDEC compliant larger mold cap still meeting Xilinx’s outer package dimensions,refer to XCN12026.View / Download1/25/2013
XCN12023 (v1.0)Assembly Process,Marking Molding,PackingXilinx's Assembly Suppliers are transitioning from corner gate mold to pin gate mold for FG G and BG G packages. Suppliers are converting mature PBGA devices to PGM for improved productivity,PGM process is designed with the JEDEC compliant larger mold cap still meeting Xilinx's outer package dimensions.View / Download12/17/2012
N/AVendor AcquisitionModesat Communications has been acquired by Xilinx.View / Download9/17/2012
N/AVendor AcquisitionPetaLogix Corporation has been acquired by Xilinx.View / Download8/28/2012
N/AVendor AcquisitionSeaMicro, Inc has been acquired by AMD.View / Download2/29/2012
XCN11002 (v1.0)MaterialsXilinx's conversion to copper wire is to align with the current industry trend to better support long-term demand for the affected products. Copper wire has demonstrated better electrical and mechanical performance than gold wire.View / Download8/15/2011
XCN11018 (v2.0)Assembly SiteDue to the recent earthquake in Japan, there is a worldwide shortage of Bismaleimide-Triazine (BT) resin material used in the package core and prepreg layers of wirebond packages. To enable supply continuity, additional sources of package core and prepreg are being qualified. The additional package core and prepreg sources are from Nanya, Hitachi and Doosan suppliers.View / Download7/25/2011
XCN11018 (v1.0.1)Assembly ProcessDue to the recent earthquake in Japan, there is a worldwide shortage of Bismaleimide-Triazine (BT) resin material used in the package core and prepreg layers of wirebond packages. To enable supply continuity, additional sources of package core and prepreg are being qualified. The additional package core and prepreg sources are from Nanya, Hitachi and Doosan suppliers.View / Download6/15/2011
XCN11018 (v1.0)Assembly SiteDue to the recent earthquake in Japan, there is a worldwide shortage of Bismaleimide-Triazine (BT) resin material used in the package core and prepreg layers of wirebond packages. To enable supply continuity, additional sources of package core and prepreg are being qualifiedView / Download6/13/2011
N/AVendor AcquisitionSarance Technologies Inc has been acquired by Xilinx.View / Download5/17/2011
N/AVendor AcquisitionModelware has been acquired by Xilinx.View / Download5/9/2011
N/AVendor AcquisitionAutoESL Design Technologies, Inc has been acquired by Xilinx.View / Download1/31/2011
XCN08006 (v1.0.1)Assembly ProcessThe purpose of this notification is to announce the addition of a new second source molding compound for selected wirebond BGA packages.View / Download4/17/2008
N/AVendor AcquisitionAMD acquires Alchemy SemiconductorView / Download11/6/2007
EN094 (v1.0)ErrataErrata for the Spartan-3E XC3S1600E FPGA.View / Download10/19/2007
N/AVendor AcquisitionAMD acquires ATI TechnologiesView / Download10/25/2006
XCN05011 (v2.0)Assembly Process,MaterialsTo consolidate material sets, Xilinx is changing the package assembly materials at all manufacturing locations for several packages.View / Download8/7/2006
N/AVendor AcquisitionAccelChip, Inc has been Acquired by Xilinx.View / Download1/13/2006
N/AVendor AcquisitionXilinx acquires TriscendView / Download3/8/2004
N/AVendor AcquisitionMonolithic Memories, Inc has been acquired by AMD.View / Download1/1/1987

LIFECYCLE:

StatusObsolete
LTB DateJun 29, 2024
SourceNot Available
Est. EOLNot Available
LifecycleObsolete
Risk GradeHigh
Overall Risk97%

ENVIRONMENT:

RoHS StatusNot Compliant
DetailsNot Available
Source TypeMaterial Declaration
ExemptionNot Available
Exemption TypeNot Available
Exemption CodesNot Available
Rohs IdentifierNO
Lead FreeNot Compliant
Rare Earth Element InformationRare Earth Free
Conflict Mineral StatusDRC Conflict Free
Conflict Mineral StatementNot Available
EICC MembershipNo