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XC3S200AN-4FTG256C

Excess Qty: 20402
**Pricing and quantities are subject to current market availability.

Overview

Manufacturer:   XILINX
Part Number:   XC3S200AN-4FTG256C
Description:   FPGA Spartan®-3AN Family 200K Gates 4032 Cells 667MHz 90nm Technology 1.2V Medical 256-Pin FTBGA
Datasheet:   View / Download
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SPECIFICATIONS:

Part Number: XC3S200AN-4FTG256C
Manufacturer: XILINX
Type: Field Programmable Gate Arrays - FPGAs
Description: FPGA Spartan®-3AN Family 200K Gates 4032 Cells 667MHz 90nm Technology 1.2V Medical 256-Pin FTBGA
Datasheet: View / Download
Lifecycle: Obsolete
RoHS: Yes
RoHS Version: 2011/65/EU, 2015/863

PCN ALERT(S):

PCN#TypeDescriptionSourceDate
XCN23009 (v1.1)Obsolescence Notices,Removed from Cost Book-NC/NRAdditional context added to description section.AMD will be discontinuing XC9500XL, CoolRunner XPLA 3, CoolRunner II, Spartan II, and Spartan 3, 3A, 3AN,3E, 3ADSP Commercial/ Industrial "XC" and Automotive "XA" Product Families due to declining run-rates and challenges maintaining legacy test infrastructure.No Replacements provided.View / Download1/29/2024
XCN23009 (v1.0)Obsolescence Notices,Removed from Cost Book-NC/NRAMD will be discontinuing XC9500XL, CoolRunner XPLA 3, CoolRunner II, Spartan II, and Spartan 3, 3A, 3AN, 3E, 3ADSP Commercial/ Industrial XC and Automotive XA Product Families.No Replacements provided.View / Download1/1/2024
XCN19020 (v1.3)LabelingXilinx will be changing the format of the label on moisture barrier bag (MBB), inner box and outer carton for all 2D products (7 Series, UltraScale, UltraScale+ and new products).View / Download12/16/2019
XCN19020 (v1.2)LabelingXilinx will be changing the format of the label on moisture barrier bag (MBB), inner box and outer carton for all 2D products (7 Series, UltraScale, UltraScale+ and new products).View / Download10/14/2019
XCN18015 (v1.0)LabelingThe purpose of this notification is to communicate that Xilinx has changed the format of the label on moisture barrier bag (MBB), inner box and outer carton for all productsView / Download5/28/2018
XTP343 (v1.6)Materials,Wafer SiteTo ensure business continuity, Xilinx is announcing a change in wafer fabrication facility location and process technology (non-optical) shrink from 0.13um to 0.11um for the in-system flash memory used in the Spartan-3AN FPGA devices.View / Download1/8/2016
XTP343 (v1.5)Materials,Wafer Process,Wafer SiteXilinx is transitioning the in-system flash memory for the Spartan-3AN FPGA devices from wafer fabrication facility X-FAB (0.13um process) to UMC (0.11um process).View / Download6/30/2015
XTP343 (v1.4)Materials,Wafer Process,Wafer SiteXilinx is announcing a change in wafer fabrication facility location and process technology (non-optical) shrink from 0.13um to 0.11um for the in-system flash memory used in the Spartan -3AN FPGA devices. In addition, Xilinx is transitioning the wire bond packages from gold (Au) to copper (Cu) wires meeting industry trends.refer to XCN11002.View / Download2/24/2015
XTP343 (v1.3)Materials,Wafer Process,Wafer SiteXilinx is announcing a change in wafer fabrication facility location and process technology (non-optical) shrink from 0.13um to 0.11um for the in-system flash memory used in the Spartan -3AN FPGA devices. In addition, Xilinx is transitioning the wire bond packages from gold (Au) to copper (Cu) wires meeting industry trends.refer to XCN11002.View / Download10/27/2014
XCN14003 (v1.3)Wafer SiteXilinx is transitioning the in-system flash memory for the Spartan-3AN FPGA devices from wafer fabrication facility X FAB (0.13um process) to UMC (0.11um process).refer to XCN13016,XCN11002View / Download10/27/2014
XCN14003 (v1.1)Materials,Wafer SiteThe purpose of this notification is to communicate a change in wafer fabrication facility location and process technology (non-optical) shrink from 0.13um to 0.11um for the in-system flash memory used in the Spartan-3AN FPGA devices.View / Download5/26/2014
XCN14003 (v1.0)Materials,Wafer Process,Wafer SiteXilinx is transitioning the in-system flash memory for the Spartan-3AN FPGA devices from wafer fabrication facility X-FAB (0.13um process) to UMC (0.11um process). Xilinx is performing the qualification and characterization on the Spartan-3AN FPGA devices which include the in-system flash with 0.11um process.View / Download5/5/2014
XCN13033 (v1.1)Assembly SiteAs part of Xilinx global supply chain continuity and efficiency, Xilinx is adding a new approved logistics service provider. This additional logistics service provider will be qualified to provide these services for all Xilinx products.At the end of this change, Xilinx will be shipping products from Xilinx USA, Xilinx Singapore, and the warehouses in Taiwan and Singapore.View / Download2/17/2014
XCN13031 (v1.1)Test SiteXilinx is adding final test capability with our current certified wafer sort test facility in Taiwan for product continuity. All Xilinx test programs will be transferred to this facility. There is no change to form, fit, function or reliability.refer to XCN14009View / Download2/10/2014
XCN13033 (v1.0)Assembly SiteAs part of Xilinx global supply chain continuity and efficiency, Xilinx is adding a new approved logistics service provider. This additional logistics service provider will be qualified to provide these services for all Xilinx products and At the end of this change, Xilinx will be shipping products from Xilinx USA, Xilinx Singapore, and the warehouses in Taiwan and Singapore.View / Download11/11/2013
XCN13031 (v1.0)Test SiteXilinx is adding final test capability with our current certified wafer sort test facility in Taiwan for product continuity. All Xilinx test programs will be transferred to this facility. There is no change to form, fit, function or reliability.View / Download11/4/2013
N/AVendor AcquisitionModesat Communications has been acquired by Xilinx.View / Download9/17/2012
N/AVendor AcquisitionPetaLogix Corporation has been acquired by Xilinx.View / Download8/28/2012
N/AVendor AcquisitionSeaMicro, Inc has been acquired by AMD.View / Download2/29/2012
XCN11002 (v1.0)MaterialsXilinx's conversion to copper wire is to align with the current industry trend to better support long-term demand for the affected products. Copper wire has demonstrated better electrical and mechanical performance than gold wire.View / Download8/15/2011
XCN11018 (v2.0)Assembly SiteDue to the recent earthquake in Japan, there is a worldwide shortage of Bismaleimide-Triazine (BT) resin material used in the package core and prepreg layers of wirebond packages. To enable supply continuity, additional sources of package core and prepreg are being qualified. The additional package core and prepreg sources are from Nanya, Hitachi and Doosan suppliers.View / Download7/25/2011
XCN11018 (v1.0.1)Assembly ProcessDue to the recent earthquake in Japan, there is a worldwide shortage of Bismaleimide-Triazine (BT) resin material used in the package core and prepreg layers of wirebond packages. To enable supply continuity, additional sources of package core and prepreg are being qualified. The additional package core and prepreg sources are from Nanya, Hitachi and Doosan suppliers.View / Download6/15/2011
XCN11018 (v1.0)Assembly SiteDue to the recent earthquake in Japan, there is a worldwide shortage of Bismaleimide-Triazine (BT) resin material used in the package core and prepreg layers of wirebond packages. To enable supply continuity, additional sources of package core and prepreg are being qualifiedView / Download6/13/2011
N/AVendor AcquisitionSarance Technologies Inc has been acquired by Xilinx.View / Download5/17/2011
N/AVendor AcquisitionModelware has been acquired by Xilinx.View / Download5/9/2011
N/AVendor AcquisitionAutoESL Design Technologies, Inc has been acquired by Xilinx.View / Download1/31/2011
XCN10017 (v1.1)Packing,ShippingXilinx is adding a new shipping tray produced by SUNRISE Plastics Industry for the 28mm x 28mm QFP packages and 31mm x 31mm BGA packagesView / Download4/26/2010
XCN08014 (v1.0)Assembly ProcessStandardization of remaining Spartan-3A devices to the current 2-layer substrate for the FT256 and FTG256 packages,All other Spartan FT/FTG256 devices currently use 2-layer substrates including Spartan-3A XC3S700A and XC3S1400A devices.View / Download10/20/2008
XCN08006 (v1.0.1)Assembly ProcessThe purpose of this notification is to announce the addition of a new second source molding compound for selected wirebond BGA packages.View / Download4/17/2008
N/AVendor AcquisitionAMD acquires Alchemy SemiconductorView / Download11/6/2007
EN028 (v1.1)ErrataErrata for the Xilinx XC3S200AN device.View / Download6/25/2007
N/AVendor AcquisitionAMD acquires ATI TechnologiesView / Download10/25/2006
N/AVendor AcquisitionAccelChip, Inc has been Acquired by Xilinx.View / Download1/13/2006
N/AVendor AcquisitionXilinx acquires TriscendView / Download3/8/2004
N/AVendor AcquisitionMonolithic Memories, Inc has been acquired by AMD.View / Download1/1/1987

LIFECYCLE:

StatusObsolete
LTB DateJun 29, 2024
SourceNot Available
Est. EOLNot Available
LifecycleObsolete
Risk GradeHigh
Overall Risk76.5%

ENVIRONMENT:

RoHS StatusCompliant
DetailsNot Available
Source TypeMaterial Declaration
ExemptionNo
Exemption TypeNot Available
Exemption CodesNot Available
Rohs IdentifierYES
Lead FreeCompliant
Rare Earth Element InformationRare Earth Free
Conflict Mineral StatusDRC Conflict Free
Conflict Mineral StatementNot Available
EICC MembershipNo