×
(877) 992-1930
Login
Register
Why Sensible
What We Do
Resources
Blog
Customer Portal
Line Card
Request a Quote
Menu
×
XA3S1200E-4FTG256I
XA3S1200E-4FTG256I
SOURCING AVAILABLE
Overview
Manufacturer
:
ADVANCED MICRO DEVICES, INC.
Part Number
:
XA3S1200E-4FTG256I
Description
:
FPGA XA Spartan®-3E Family 1.2M Gates 19512 Cells 572MHz 90nm Technology 1.2V Automotive AEC-Q100 256-Pin FTBGA
Datasheet
:
View / Download
Get Quote
Specifications
PCN
Lifecycle
Environment
SPECIFICATIONS:
Part Number:
XA3S1200E-4FTG256I
Manufacturer:
ADVANCED MICRO DEVICES, INC.
Type:
Field Programmable Gate Arrays - FPGAs
Description:
FPGA XA Spartan®-3E Family 1.2M Gates 19512 Cells 572MHz 90nm Technology 1.2V Automotive AEC-Q100 256-Pin FTBGA
Datasheet:
View / Download
Lifecycle:
Obsolete
RoHS:
Yes
RoHS Version:
2011/65/EU, 2015/863
PCN ALERT(S):
PCN#
Type
Description
Source
Date
XCN23009 (v1.1)
Obsolescence Notices,Removed from Cost Book-NC/NR
Additional context added to description section.AMD will be discontinuing XC9500XL, CoolRunner XPLA 3, CoolRunner II, Spartan II, and Spartan 3, 3A, 3AN,3E, 3ADSP Commercial/ Industrial "XC" and Automotive "XA" Product Families due to declining run-rates and challenges maintaining legacy test infrastructure.No Replacements provided.
View / Download
1/29/2024
XCN23009 (v1.0)
Obsolescence Notices,Removed from Cost Book-NC/NR
AMD will be discontinuing XC9500XL, CoolRunner XPLA 3, CoolRunner II, Spartan II, and Spartan 3, 3A, 3AN, 3E, 3ADSP Commercial/ Industrial XC and Automotive XA Product Families.No Replacements provided.
View / Download
1/1/2024
XCN19020 (v1.3)
Labeling
Xilinx will be changing the format of the label on moisture barrier bag (MBB), inner box and outer carton for all 2D products (7 Series, UltraScale, UltraScale+ and new products).
View / Download
12/16/2019
XCN19020 (v1.2)
Labeling
Xilinx will be changing the format of the label on moisture barrier bag (MBB), inner box and outer carton for all 2D products (7 Series, UltraScale, UltraScale+ and new products).
View / Download
10/14/2019
XCN18015 (v1.0)
Labeling
The purpose of this notification is to communicate that Xilinx has changed the format of the label on moisture barrier bag (MBB), inner box and outer carton for all products
View / Download
5/28/2018
XTP403 (v1.0)
Assembly Process,Materials
Xilinx is converting Automotive XA Spartan-6 and Automotive XA Spartan-3/-3E/-3A/-3A DSP to copper wire in order to align with our Commercial/Industrial products and overall product strategy including 7 Series Artix FPGA and Zynq SoC products along industry direction to support long-term demand for the affected products.
View / Download
7/6/2015
XCN15005 (v1.0)
Assembly Process,Materials
Xilinx will be transitioning all wire bond package types for Automotive XA Spartan-3/-3E/-3A/-3A DSP and Spartan-6 FPGA products from gold (Au) to copper (Cu) wire. For the Cu-wire assembly, only halogen free, EU-ROHS compliant packages and green mold compound will be used.Refer to XCN11002, XCN14001, and XCN14003
View / Download
7/6/2015
XCN14011 (v1.0)
Assembly Site
As part of Xilinx global supply chain continuity and efficiency, Xilinx is adding a new approved logistics service provider. This additional logistics service provider will be qualified to provide these services for all Xilinx Automotive (XA) products.
View / Download
2/17/2014
XCN14009 (v1.0)
Test Site
Xilinx is adding a final test site capability to our current qualified wafer sort test facility in Taiwan for product supply and continuity. All Xilinx Automotive (XA) Spartan-3/-3E/-3A/-3ADSP and Spartan-6 FPGA product family test programs and test platforms will be transferred to this facility.
View / Download
2/10/2014
XCN12024 (v1.0)
Assembly Process,Marking Molding,Packing
Xilinx's Assembly Suppliers are transitioning from corner gate mold to pin gate mold for FG G and BG G packages affecting XC commercial C and I grade FPGA devices Ref. XCN12023,Xilinx will not implement PGM method to Automotive XA and HiRel XQ FPGA products. However, a minor top marking template package and tray change are necessary,refer to XCN12023,XCN12026
View / Download
12/17/2012
N/A
Vendor Acquisition
Modesat Communications has been acquired by Xilinx.
View / Download
9/17/2012
N/A
Vendor Acquisition
PetaLogix Corporation has been acquired by Xilinx.
View / Download
8/28/2012
N/A
Vendor Acquisition
SeaMicro, Inc has been acquired by AMD.
View / Download
2/29/2012
XCN11002 (v1.0)
Materials
Xilinx's conversion to copper wire is to align with the current industry trend to better support long-term demand for the affected products. Copper wire has demonstrated better electrical and mechanical performance than gold wire.
View / Download
8/15/2011
N/A
Vendor Acquisition
Sarance Technologies Inc has been acquired by Xilinx.
View / Download
5/17/2011
N/A
Vendor Acquisition
Modelware has been acquired by Xilinx.
View / Download
5/9/2011
N/A
Vendor Acquisition
AutoESL Design Technologies, Inc has been acquired by Xilinx.
View / Download
1/31/2011
XCN10001 (v1.0)
Test Site
Xilinx has qualified SPIL and Amkor to correlate to Xilinx test facilities for final electrical testing.
View / Download
3/1/2010
XCN09027 (v1.0)
Datasheet Specifications,Marking Molding
XA spartan-3E automotive FPGA data sheet change
View / Download
11/9/2009
XCN08006 (v1.0.1)
Assembly Process
The purpose of this notification is to announce the addition of a new second source molding compound for selected wirebond BGA packages.
View / Download
4/17/2008
N/A
Vendor Acquisition
AMD acquires Alchemy Semiconductor
View / Download
11/6/2007
N/A
Vendor Acquisition
AMD acquires ATI Technologies
View / Download
10/25/2006
N/A
Vendor Acquisition
AccelChip, Inc has been Acquired by Xilinx.
View / Download
1/13/2006
N/A
Vendor Acquisition
Xilinx acquires Triscend
View / Download
3/8/2004
N/A
Vendor Acquisition
Monolithic Memories, Inc has been acquired by AMD.
View / Download
1/1/1987
LIFECYCLE:
Status
Obsolete
LTB Date
Jun 29, 2024
Source
Not Available
Est. EOL
Not Available
Lifecycle
Obsolete
Risk Grade
High
Overall Risk
87.1%
ENVIRONMENT:
RoHS Status
Compliant
Details
Not Available
Source Type
Material Declaration
Exemption
No
Exemption Type
Not Available
Exemption Codes
Not Available
Rohs Identifier
NO
Lead Free
Compliant
Rare Earth Element Information
Not Available
Conflict Mineral Status
DRC Conflict Free
Conflict Mineral Statement
Not Available
EICC Membership
No
×
Quote Request In Process.
Thank you, we will be in touch with you shortly.
Details: