Image for XA3S1200E-4FTG256I
XA3S1200E-4FTG256I Part Image

XA3S1200E-4FTG256I

SOURCING AVAILABLE

Overview

Manufacturer:   ADVANCED MICRO DEVICES, INC.
Part Number:   XA3S1200E-4FTG256I
Description:   FPGA XA Spartan®-3E Family 1.2M Gates 19512 Cells 572MHz 90nm Technology 1.2V Automotive AEC-Q100 256-Pin FTBGA
Datasheet:   View / Download
Get Quote

SPECIFICATIONS:

Part Number: XA3S1200E-4FTG256I
Manufacturer: ADVANCED MICRO DEVICES, INC.
Type: Field Programmable Gate Arrays - FPGAs
Description: FPGA XA Spartan®-3E Family 1.2M Gates 19512 Cells 572MHz 90nm Technology 1.2V Automotive AEC-Q100 256-Pin FTBGA
Datasheet: View / Download
Lifecycle: LTB
RoHS: Yes
RoHS Version: 2011/65/EU, 2015/863

PCN ALERT(S):

PCN#TypeDescriptionSourceDate
XCN23009 (v1.1)Obsolescence Notices,Removed from Cost Book-NC/NRAdditional context added to description section.AMD will be discontinuing XC9500XL, CoolRunner XPLA 3, CoolRunner II, Spartan II, and Spartan 3, 3A, 3AN,3E, 3ADSP Commercial/ Industrial "XC" and Automotive "XA" Product Families due to declining run-rates and challenges maintaining legacy test infrastructure.No Replacements provided.View / Download1/29/2024
XCN23009 (v1.0)Obsolescence Notices,Removed from Cost Book-NC/NRAMD will be discontinuing XC9500XL, CoolRunner XPLA 3, CoolRunner II, Spartan II, and Spartan 3, 3A, 3AN, 3E, 3ADSP Commercial/ Industrial XC and Automotive XA Product Families.No Replacements provided.View / Download1/1/2024
XCN19020 (v1.3)LabelingXilinx will be changing the format of the label on moisture barrier bag (MBB), inner box and outer carton for all 2D products (7 Series, UltraScale, UltraScale+ and new products).View / Download12/16/2019
XCN19020 (v1.2)LabelingXilinx will be changing the format of the label on moisture barrier bag (MBB), inner box and outer carton for all 2D products (7 Series, UltraScale, UltraScale+ and new products).View / Download10/14/2019
XCN18015 (v1.0)LabelingThe purpose of this notification is to communicate that Xilinx has changed the format of the label on moisture barrier bag (MBB), inner box and outer carton for all productsView / Download5/28/2018
XCN15005 (v1.0)Assembly Process,MaterialsXilinx will be transitioning all wire bond package types for Automotive XA Spartan-3/-3E/-3A/-3A DSP and Spartan-6 FPGA products from gold (Au) to copper (Cu) wire. For the Cu-wire assembly, only halogen free, EU-ROHS compliant packages and green mold compound will be used.Refer to XCN11002, XCN14001, and XCN14003View / Download7/6/2015
XTP403 (v1.0)Assembly Process,MaterialsXilinx is converting Automotive XA Spartan-6 and Automotive XA Spartan-3/-3E/-3A/-3A DSP to copper wire in order to align with our Commercial/Industrial products and overall product strategy including 7 Series Artix FPGA and Zynq SoC products along industry direction to support long-term demand for the affected products.View / Download7/6/2015
XCN14011 (v1.0)Assembly SiteAs part of Xilinx global supply chain continuity and efficiency, Xilinx is adding a new approved logistics service provider. This additional logistics service provider will be qualified to provide these services for all Xilinx Automotive (XA) products.View / Download2/17/2014
XCN14009 (v1.0)Test SiteXilinx is adding a final test site capability to our current qualified wafer sort test facility in Taiwan for product supply and continuity. All Xilinx Automotive (XA) Spartan-3/-3E/-3A/-3ADSP and Spartan-6 FPGA product family test programs and test platforms will be transferred to this facility.View / Download2/10/2014
XCN12024 (v1.0)Assembly Process,Marking Molding,PackingXilinx's Assembly Suppliers are transitioning from corner gate mold to pin gate mold for FG G and BG G packages affecting XC commercial C and I grade FPGA devices Ref. XCN12023,Xilinx will not implement PGM method to Automotive XA and HiRel XQ FPGA products. However, a minor top marking template package and tray change are necessary,refer to XCN12023,XCN12026View / Download12/17/2012
N/AVendor AcquisitionModesat Communications has been acquired by Xilinx.View / Download9/17/2012
N/AVendor AcquisitionPetaLogix Corporation has been acquired by Xilinx.View / Download8/28/2012
N/AVendor AcquisitionSeaMicro, Inc has been acquired by AMD.View / Download2/29/2012
XCN11002 (v1.0)MaterialsXilinx's conversion to copper wire is to align with the current industry trend to better support long-term demand for the affected products. Copper wire has demonstrated better electrical and mechanical performance than gold wire.View / Download8/15/2011
N/AVendor AcquisitionSarance Technologies Inc has been acquired by Xilinx.View / Download5/17/2011
N/AVendor AcquisitionModelware has been acquired by Xilinx.View / Download5/9/2011
N/AVendor AcquisitionAutoESL Design Technologies, Inc has been acquired by Xilinx.View / Download1/31/2011
XCN10001 (v1.0)Test SiteXilinx has qualified SPIL and Amkor to correlate to Xilinx test facilities for final electrical testing.View / Download3/1/2010
XCN09027 (v1.0)Datasheet Specifications,Marking MoldingXA spartan-3E automotive FPGA data sheet changeView / Download11/9/2009
XCN08006 (v1.0.1)Assembly ProcessThe purpose of this notification is to announce the addition of a new second source molding compound for selected wirebond BGA packages.View / Download4/17/2008
N/AVendor AcquisitionAMD acquires Alchemy SemiconductorView / Download11/6/2007
N/AVendor AcquisitionAMD acquires ATI TechnologiesView / Download10/25/2006
N/AVendor AcquisitionAccelChip, Inc has been Acquired by Xilinx.View / Download1/13/2006
N/AVendor AcquisitionXilinx acquires TriscendView / Download3/8/2004
N/AVendor AcquisitionMonolithic Memories, Inc has been acquired by AMD.View / Download1/1/1987

LIFECYCLE:

StatusLTB
LTB DateJun 29, 2024
SourceNot Available
Est. EOL2024
LifecyclePhase Out
Risk GradeHigh
Overall Risk87.1%

ENVIRONMENT:

RoHS StatusCompliant
DetailsNot Available
Source TypeMaterial Declaration
ExemptionNo
Exemption TypeNot Available
Exemption CodesNot Available
Rohs IdentifierNO
Lead FreeCompliant
Rare Earth Element InformationNot Available
Conflict Mineral StatusDRC Conflict Undeterminable
Conflict Mineral StatementNot Available
EICC MembershipNo