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XC9572XL-10VQ44C

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Overview

Manufacturer:   ADVANCED MICRO DEVICES, INC.
Part Number:   XC9572XL-10VQ44C
Description:   CPLD XC9500 Family 1.6K Gates 72 Macro Cells 100MHz 0.35um, CMOS Technology 3.3V 44-Pin VQFP
Datasheet:   View / Download
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SPECIFICATIONS:

Part Number: XC9572XL-10VQ44C
Manufacturer: ADVANCED MICRO DEVICES, INC.
Type: Complex Programmable Logic Devices - CPLDs
Description: CPLD XC9500 Family 1.6K Gates 72 Macro Cells 100MHz 0.35um, CMOS Technology 3.3V 44-Pin VQFP
Datasheet: View / Download
Lifecycle: LTB
RoHS: No
RoHS Version: 2011/65/EU, 2015/863

PCN ALERT(S):

PCN#TypeDescriptionSourceDate
XCN23009 (v1.1)Obsolescence Notices,Removed from Cost Book-NC/NRAdditional context added to description section.AMD will be discontinuing XC9500XL, CoolRunner XPLA 3, CoolRunner II, Spartan II, and Spartan 3, 3A, 3AN,3E, 3ADSP Commercial/ Industrial "XC" and Automotive "XA" Product Families due to declining run-rates and challenges maintaining legacy test infrastructure.No Replacements provided.View / Download1/29/2024
XCN23009 (v1.0)Obsolescence Notices,Removed from Cost Book-NC/NRAMD will be discontinuing XC9500XL, CoolRunner XPLA 3, CoolRunner II, Spartan II, and Spartan 3, 3A, 3AN, 3E, 3ADSP Commercial/ Industrial XC and Automotive XA Product Families.No Replacements provided.View / Download1/1/2024
XTP526 (v1.2)MaterialsXilinx assembly supplier will stop Sn/Pb solder planting process in devices from date code DC2001. Therefore, Xilinx has changed the lead-frame from Ag L/F plating to PPFView / Download11/23/2020
XTP526 (v1.1)MaterialsTo ensure business continuity and enable high-volume supply-chain capability for all tin-lead (Sn/Pb) plating type products, Xilinx is qualifying Pre-Plated Lead-Frame (PPF) without solder plating process for QFP packages.View / Download3/30/2020
XCN19020 (v1.3)LabelingXilinx will be changing the format of the label on moisture barrier bag (MBB), inner box and outer carton for all 2D products (7 Series, UltraScale, UltraScale+ and new products).View / Download12/16/2019
XCN19020 (v1.2)LabelingXilinx will be changing the format of the label on moisture barrier bag (MBB), inner box and outer carton for all 2D products (7 Series, UltraScale, UltraScale+ and new products).View / Download10/14/2019
XTP526 (v1.0)Assembly ProcessXilinx is qualifying Pre-Plated Lead-Frame (PPF) without solder plating process for QFP packagesView / Download10/29/2018
XCN18024 (v1.0)MaterialsXilinx will be changing lead-frame plating composition from the current tin-lead (Sn/Pb) to palladium-nickel-gold (Pd/Ni/Au) using a pre-plated lead-frameView / Download10/29/2018
XCN18015 (v1.0)LabelingThe purpose of this notification is to communicate that Xilinx has changed the format of the label on moisture barrier bag (MBB), inner box and outer carton for all productsView / Download5/28/2018
XCN13033 (v1.1)Assembly SiteAs part of Xilinx global supply chain continuity and efficiency, Xilinx is adding a new approved logistics service provider. This additional logistics service provider will be qualified to provide these services for all Xilinx products.At the end of this change, Xilinx will be shipping products from Xilinx USA, Xilinx Singapore, and the warehouses in Taiwan and Singapore.View / Download2/17/2014
XCN13031 (v1.1)Test SiteXilinx is adding final test capability with our current certified wafer sort test facility in Taiwan for product continuity. All Xilinx test programs will be transferred to this facility. There is no change to form, fit, function or reliability.refer to XCN14009View / Download2/10/2014
XCN13033 (v1.0)Assembly SiteAs part of Xilinx global supply chain continuity and efficiency, Xilinx is adding a new approved logistics service provider. This additional logistics service provider will be qualified to provide these services for all Xilinx products and At the end of this change, Xilinx will be shipping products from Xilinx USA, Xilinx Singapore, and the warehouses in Taiwan and Singapore.View / Download11/11/2013
XCN13031 (v1.0)Test SiteXilinx is adding final test capability with our current certified wafer sort test facility in Taiwan for product continuity. All Xilinx test programs will be transferred to this facility. There is no change to form, fit, function or reliability.View / Download11/4/2013
XCN12022 (v1.0)Assembly Process,Marking MoldingXilinx's Assembly Suppliers are converting from corner gate mold to pin gate mold for TQ G 100, TQ G 144 and VQ G 100 packages,Suppliers are transitioning mature TQ G and VQ G devices to PGM for improved productivity,The PGM process is designed with JEDEC compliant package drawing and there is no change to Xilinx package dimensions,refer to XCN12026View / Download12/17/2012
N/AVendor AcquisitionModesat Communications has been acquired by Xilinx.View / Download9/17/2012
N/AVendor AcquisitionPetaLogix Corporation has been acquired by Xilinx.View / Download8/28/2012
N/AVendor AcquisitionSeaMicro, Inc has been acquired by AMD.View / Download2/29/2012
XCN11018 (v2.0)Assembly SiteDue to the recent earthquake in Japan, there is a worldwide shortage of Bismaleimide-Triazine (BT) resin material used in the package core and prepreg layers of wirebond packages. To enable supply continuity, additional sources of package core and prepreg are being qualified. The additional package core and prepreg sources are from Nanya, Hitachi and Doosan suppliers.View / Download7/25/2011
XCN11018 (v1.0.1)Assembly ProcessDue to the recent earthquake in Japan, there is a worldwide shortage of Bismaleimide-Triazine (BT) resin material used in the package core and prepreg layers of wirebond packages. To enable supply continuity, additional sources of package core and prepreg are being qualified. The additional package core and prepreg sources are from Nanya, Hitachi and Doosan suppliers.View / Download6/15/2011
XCN11018 (v1.0)Assembly SiteDue to the recent earthquake in Japan, there is a worldwide shortage of Bismaleimide-Triazine (BT) resin material used in the package core and prepreg layers of wirebond packages. To enable supply continuity, additional sources of package core and prepreg are being qualifiedView / Download6/13/2011
N/AVendor AcquisitionSarance Technologies Inc has been acquired by Xilinx.View / Download5/17/2011
N/AVendor AcquisitionModelware has been acquired by Xilinx.View / Download5/9/2011
N/AVendor AcquisitionAutoESL Design Technologies, Inc has been acquired by Xilinx.View / Download1/31/2011
N/AVendor AcquisitionAMD acquires Alchemy SemiconductorView / Download11/6/2007
N/AVendor AcquisitionAMD acquires ATI TechnologiesView / Download10/25/2006
N/AVendor AcquisitionAccelChip, Inc has been Acquired by Xilinx.View / Download1/13/2006
XCN05003 (v1.0)Marking Molding,Product Code,Wafer SiteThe XC95144XL and XC9572XL CPLD devices will transition from a 0.35µm four-layer metal Flash CMOS process at UMC, Taiwan to a 0.35µm four-layer metal Flash CMOS process at He Jian Technology Company, China. This change improves the ability of Xilinx to support this product effectivelyView / Download1/31/2005
XCN05003Wafer ProcessChange in Wafer Fabrication Facility for XC95144XL and XC9572XL CPLDs.View / Download1/31/2005
N/AVendor AcquisitionXilinx acquires TriscendView / Download3/8/2004
N/AVendor AcquisitionMonolithic Memories, Inc has been acquired by AMD.View / Download1/1/1987

LIFECYCLE:

StatusLTB
LTB DateJun 29, 2024
SourceNot Available
Est. EOL2024
LifecyclePhase Out
Risk GradeHigh
Overall Risk83.6%

ENVIRONMENT:

RoHS StatusNot Compliant
DetailsNot Available
Source TypeCertificate of Compliance
ExemptionNot Available
Exemption TypeNot Available
Exemption CodesNot Available
Rohs IdentifierNO
Lead FreeNot Compliant
Rare Earth Element InformationNot Available
Conflict Mineral StatusDRC Conflict Undeterminable
Conflict Mineral StatementNot Available
EICC MembershipNo